PG

SW

VOS

FB

Exposed

Thermal

Pad

PGND

VIN

EN

AGND

7

6

2

3

1

4

8

5

3

TPS62160-Q1, TPS62162-Q1

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SLVSCK6A – DECEMBER 2014 – REVISED NOVEMBER 2016

Product Folder Links: TPS62160-Q1 TPS62162-Q1

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6 Device Comparison Table

(1)

For detailed ordering information please check the Mechanical, Packaging, and Orderable Information

section at the end of this datasheet.

OUTPUT VOLTAGE

TPS62160-Q1

adjustable

TPS62162-Q1

3.3 V

(1)

For more information about connecting pins, see Detailed Description and Application Information sections.

7 Pin Configuration and Functions

space

8-Pin WSON

DSG Package

(Top View)

space

space

Pin Functions

I/O

DESCRIPTION

NAME

NUMBER

PGND

1

Power ground

VIN

2

I

Supply voltage

EN

3

I

Enable input (High = enabled, Low = disabled)

AGND

4

Analog Ground

FB

5

I

Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. It is

recommended to connect FB to AGND on fixed output voltage versions for improved thermal

performance.

VOS

6

I

Output voltage sense pin and connection for the control loop circuitry.

SW

7

O

Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and

output capacitor.

PG

8

O

Output power good (High = VOUT ready, Low = VOUT below nominal regulation) ; open drain

(requires pull-up resistor; goes high impedance, when device is switched off)

Exposed

Thermal Pad

Must be connected to AGND. Must be soldered to achieve appropriate power dissipation and

mechanical reliability.