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TPS62130A-Q1_016 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS62130A-Q1_016 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 37 page 4 TPS62130A-Q1, TPS62133A-Q1, TPS6213013A-Q1 SLVSCC2B – MAY 2014 – REVISED NOVEMBER 2016 www.ti.com Product Folder Links: TPS62130A-Q1 TPS62133A-Q1 TPS6213013A-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network ground terminal. 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Pin voltage (2) AVIN, PVIN –0.3 20 V EN, SS/TR, SW –0.3 VIN+0.3 DEF, LOG, FB, PG, VOS –0.3 7 V Power Good sink current PG 10 mA Temperature Operating junction temperature, TJ –40 150 °C Storage temperature Tstg –65 150 °C (1) Electrostatic discharge (ESD) measures device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device. (2) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) (1) Electrostatic discharge Human body model (HBM), per AEC Q100-002(2) ±2000 V Charged device model (CDM), per AEC Q100-011 ±500 7.3 Recommended Operating Conditions MIN TYP MAX UNIT VIN Supply Voltage at AVIN and PVIN 3 17 V VOUT Output Voltage Range TPS62130A-Q1 0.9 6 V TJ Operating junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPS6213xA-Q1 UNIT RGT 16 PINS RθJA Junction-to-ambient thermal resistance 45 °C/W RθJC(top) Junction-to-case (top) thermal resistance 53.6 °C/W RθJB Junction-to-board thermal resistance 17.4 °C/W ψJT Junction-to-top characterization parameter 1.1 °C/W ψJB Junction-to-board characterization parameter 17.4 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 4.5 °C/W |
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Similar Description - TPS62130A-Q1_016 |
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