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MLX90316EGOBDG-100TU Datasheet(PDF) 6 Page - Melexis Microelectronic Systems

Part # MLX90316EGOBDG-100TU
Description  Rotary Position Sensor IC
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Manufacturer  MELEXIS [Melexis Microelectronic Systems]
Direct Link  http://www.melexis.com
Logo MELEXIS - Melexis Microelectronic Systems

MLX90316EGOBDG-100TU Datasheet(HTML) 6 Page - Melexis Microelectronic Systems

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MLX90316
Rotary Position Sensor IC
3901090316
Page 6 of 45
Jul/13
Rev10
15. MLX90316 SELF DIAGNOSTIC.......................................................................................................... 28
16. SERIAL PROTOCOL........................................................................................................................... 30
16.1.
INTRODUCTION .........................................................................................................................................30
16.2.
SERIAL PROTOCOL MODE ...................................................................................................................30
16.3.
MOSI (MASTER OUT SLAVE IN) ...............................................................................................................30
16.4.
MISO (MASTER IN SLAVE OUT) ...............................................................................................................30
16.5.
SS (SLAVE SELECT) ..................................................................................................................................30
16.6.
MASTER START-UP ...................................................................................................................................30
16.7.
SLAVE START-UP......................................................................................................................................30
16.8.
TIMING......................................................................................................................................................31
16.9.
SLAVE RESET ............................................................................................................................................32
16.10.
FRAME LAYER ..........................................................................................................................................32
16.10.1.
Command Device Mechanism ..........................................................................................................32
16.10.2.
Data Frame Structure ......................................................................................................................32
16.10.3.
Timing...............................................................................................................................................32
16.10.4.
Data Structure ..................................................................................................................................33
16.10.5.
Angle Calculation.............................................................................................................................33
16.10.6.
Error Handling.................................................................................................................................33
17. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 34
17.1.
ANALOG OUTPUT WIRING WITH THE MLX90316 IN SOIC PACKAGE.......................................................34
17.2.
ANALOG OUTPUT WIRING WITH THE MLX90316 IN TSSOP PACKAGE....................................................35
17.3.
PWM LOW SIDE OUTPUT WIRING ............................................................................................................35
17.4.
SERIAL PROTOCOL ....................................................................................................................................36
17.4.1.
SPI Version – Single Die ......................................................................................................................36
17.4.2.
SPI Version – Dual Die ........................................................................................................................37
17.4.3.
Non SPI Version (Standard Version)....................................................................................................38
18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 39
19. ESD PRECAUTIONS........................................................................................................................... 39
20. PACKAGE INFORMATION.................................................................................................................. 40
20.1.
SOIC8 - PACKAGE DIMENSIONS ...............................................................................................................40
20.2.
SOIC8 - PINOUT AND MARKING ...............................................................................................................40
20.3.
SOIC8 - IMC POSITIONNING.....................................................................................................................41
20.4.
TSSOP16 - PACKAGE DIMENSIONS ..........................................................................................................42
20.5.
TSSOP16 - PINOUT AND MARKING ..........................................................................................................43
20.6.
TSSOP16 - IMC POSITIONNING................................................................................................................43
21.DISCLAIMER………………………………………………………………………………………………........45


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