2004.12.22

Numeric Display/Case Size 22.8 x 33.0 mm

105/107 Series

Page 10

TTW (Through The Wave) soldering Conditions

Pre-heating

Solder Bath Temp.

Dipping Time

100 ℃

60 s

1) The dip soldering process shall be 2 times maximum.

2) The product shall be cooled to normal temperature before the second dipping process.

Manual Soldering Conditions

265 ℃

5 s

(MAX.) Resin surface temperature

(MAX.)

(MAX.)

(MAX.)

Iron tip temp.

Soldering time and frequency

3 s

2 times

400 ℃

(MAX.)

(MAX.)

(MAX.) (30 W Max.)

Position

At least 2.0 mm away from resin body

Position

At least 2.0 mm away from resin body