MC74VHCT14A

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2

Figure 1. Logic Diagram

Y1

A1

A2

A3

A4

A5

A6

Y2

Y3

Y4

Y5

Y6

1

3

5

9

11

13

2

4

6

8

10

12

Y = A

13

14

12

11

10

9

8

2

1

3

4

567

A6

Y6

A5

Y5

A4

Y4

A1

Y1

A2

Y2

A3

Y3

GND

Pinout: 14−Lead Packages (Top View)

MAXIMUM RATINGS

Parameter

Symbol

Value

Unit

DC Supply Voltage

−0.5 to +7.0

V

DC Input Voltage

−0.5 to +7.0

V

DC Output Voltage

Output in HIGH or LOW State (Note 1)

V

−0.5 to 7.0

V

DC Input Diode Current

−20

mA

DC Output Diode Current

$20

mA

DC Output Source/Sink Current

$25

mA

DC Supply Current per Supply Pin

$50

mA

DC Ground Current per Ground Pin

$50

mA

Storage Temperature Range

−65 to +150

°C

Lead Temperature, 1 mm from Case for 10 Seconds

260

°C

Junction Temperature under Bias

+150

°C

Thermal Resistance

SOIC

TSSOP

125

170

°C/W

Power Dissipation in Still Air

SOIC

TSSOP

500

450

mW

ESD Withstand Voltage

Human Body Model (Note 2)

Machine Model (Note 3)

Charged Device Model (Note 4)

>2000

>200

2000

V

Latchup Performance

$300

mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to JESD22−C101−A.

5. Tested to EIA/JESD78.