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HMC572 Datasheet(PDF) 9 Page - Micross Components |
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HMC572 Datasheet(HTML) 9 Page - Micross Components |
9 / 11 page 3 3 - 151 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Pad Number Function Description Interface Schematic 1VddRF Power supply for RF LNA. External RF bypass capacitors are required. 2VddLO2 Power supply for second stage of LO amplifier. External RF bypass capacitors are required. 3VddLO Power supply for first stage of LO amplifier. External RF bypass capacitors are required. 4LO This pad is AC coupled and matched to 50 Ohms. 5IF1 This pad is DC coupled for applications not requiring operation to DC. This port should be DC blocked exter- nally using a series capacitor whose value has been chosen to pass the necessary frequency range. For operation to DC, this pad must not source / sink more than 3 mA of current or die non - function and possible die failure will result. 6IF2 7RF This pad is AC coupled and matched to 50 Ohms. GND The backside of the die must be connected to RF/DC ground. Pad Descriptions Typical Application HMC572 v02.0809 GaAs MMIC I/Q DOWNCONVERTER 24 - 28 GHz |
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