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BH7673G Datasheet(PDF) 5 Page - Rohm |
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BH7673G Datasheet(HTML) 5 Page - Rohm |
5 / 13 page Technical Note 5/9 BH7673G www.rohm.com 2015.03 - Rev.B © 2015 ROHM Co., Ltd. All rights reserved. ●Cautions for use 1. The numerical values and data shown here are typical design values, not guaranteed values. 2. The application circuit examples show recommended circuits, but characteristics should be checked carefully before using these circuits. If any external part constants are modified before use, factors such as variation in all external parts and ROHM LSI ICs, including not only static characteristics but also transient characteristics, should be fully considered to set an ample margin. 3. Absolute maximum ratings If the absolute maximum ratings for applied voltage and/or operation temperature are exceeded, LSI damage may result. Therefore, do not apply voltage or use in a temperature that exceeds these absolute maximum ratings. If it is possible that absolute maximum ratings will be exceeded, use a physical safety device such as a fuse and make sure that no conditions that might exceed the absolute maximum ratings will be applied to the LSI IC. 4. GND potential Regardless of the operation mode, the voltage of the GND pin should be at least the minimum voltage. Actually check whether or not the voltage at each pin, including transient phenomena, is less than the GND pin voltage. 5. Thermal design The thermal design should be done using an ample margin that takes into consideration the allowable dissipation under actual use conditions. 6. Shorts between pins and mounting errors When mounting LSI ICs onto the circuit board, make sure each LSI's orientation and position is correct. The ICs may become damaged if they are not mounted correctly when the power is turned on. Similarly, damage may also result if a short occurs, such as when a foreign object is positioned between pins in an IC, or between a pin and a power supply or GND connection 7. Operation in strong electromagnetic field When used within a strong electromagnetic field, evaluate carefully to avoid the risk of operation faults 8. Place the power supply's decoupling capacitor as close as possible to the VCC pin (PIN 3) and GND pin (PIN 2). 9. The parasitic capacitance of the application board may cause the peak of the frequency characteristic response to occur at a high frequency. To lower the peak of the frequency characteristic, connect in series resistors having resistance of several dozen ohm to several hundred ohm as close as possible to the output pin. 10. The attention point when treating HD signal As shown in reference data Fig.20, BH7673G have the frequency characteristic of equal to or more than 30 MHz but by the influence with the parasitic capacitance of the application board and so on, a characteristic as in the carrying data isn't sometimes gotten. The frequency characteristic can be improved in inserting about 2kΩ ~ 3kΩ resistance between the output terminal and the GND terminal to the case. 1 OUT Resistors (several dozen Ω to several hundredΩ) to lower peak frequency Fig.7 Positions where Resistors are Inserted to Lower Peak Frequency Response OUT The resistance for the frequency characteristic improvement2kΩ~3kΩ 1 2 GND Fig.8 The resistance insertion position for the frequency characteristic improvement |
Similar Part No. - BH7673G_15 |
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Similar Description - BH7673G_15 |
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