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R6007MND3 Datasheet(PDF) 2 Page - Rohm |
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R6007MND3 Datasheet(HTML) 2 Page - Rohm |
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2 / 14 page  R6007MND3 Datasheet l lThermal resistance Parameter Symbol Values Unit Min. Typ. Max. Thermal resistance, junction - case RthJC*4 - - 1.31 ℃/W Thermal resistance, junction - ambient RthJA - - 100 ℃/W Soldering temperature, wavesoldering for 10s Tsold - - 265 ℃ l lElectrical characteristics (Ta = 25°C) Parameter Symbol Conditions Values Unit Min. Typ. Max. Drain - Source breakdown voltage V(BR)DSS VGS = 0V, ID = 1mA 600 - - V Zero gate voltage drain current IDSS VDS = 600V, VGS = 0V μA Tj = 25°C - - 100 Tj = 125°C - - - Gate - Source leakage current IGSS VGS = ±30V, VDS = 0V - - ±100 nA Gate threshold voltage VGS(th) VDS = 10V, ID = 135μA 3.0 - 5.0 V Static drain - source on - state resistance RDS(on)*3 VGS = 10V, ID = 3.5A Ω Tj = 25°C - 0.540 0.730 Tj = 125°C - - - Gate resistance RG f = 1MHz, open drain - 3.5 - Ω www.rohm.com © 2016 ROHM Co., Ltd. All rights reserved. 2/11 20160714 - Rev.003 |
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