3

3 - 115

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Harmonics of LO

LO Freq. (GHz)

nLO Spur at RF Port

1234

10.5

43

49

58

79

11.5

49

47

61

61

12.5

50

51

63

53

13.5

49

52

67

xx

14.5

50

48

69

xx

15.5

49

54

71

xx

LO = +19 dBm

Values in dBc below input LO level measured at RF Port.

MxN Spurious Outputs

nLO

mRF

0

1234

0xx

-12

7

14

xx

1240

51

59

70

2

79

737479

91

387

102

99

86

97

4xx

84

102

97

105

RF = 13.6 GHz @ -10 dBm

LO = 13.5 GHz @ +19 dBm

Data taken without IF hybrid

All values in dBc below IF power level

Absolute Maximum Ratings

RF / IF Input

+20 dBm

LO Drive

27 dBm

Channel Temperature

150°C

Continuous Pdiss (T=85°C)

(derate 6.9 mW/°C above 85°C)

452 mW

Thermal Resistance (R

TH

)

(junction to die bottom)

150 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 deg °C

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. DIE THICKNESS IS .004”

3. TYPICAL BOND PAD IS .004”

4. BACKSIDE METALIZATION: GOLD

5. BOND PAD METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. CONNECTION NOT REQUIRED FOR

UNLABELED BOND PADS.

8. OVERALL DIE SIZE ±.002”

Standard

Alternate

GP-2 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC528

GaAs MMIC I/Q MIXER

11 - 16 GHz

v01.0907