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SM813XXX Datasheet(PDF) 6 Page - Microchip Technology |
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SM813XXX Datasheet(HTML) 6 Page - Microchip Technology |
6 / 21 page SM813XXX DS20005538B-page 6 2016 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Ambient Temperature TA –40 — +85 °C Note 1 Storage Temperature Range TS –65 — +150 °C — Lead Temperature — — — +260 °C Soldering, 20s Case Temperature — — — +115 °C — Package Thermal Resistances Junction Thermal Resistance QFN, Still Air JA —24 — °C/W — Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability. |
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