SM813XXX

DS20005538B-page 6

 2016 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Ambient Temperature

–40

—

+85

°C

Note 1

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 20s

Case Temperature

—

—

—

+115

°C

—

Package Thermal Resistances

Junction Thermal Resistance QFN, Still

Air

—24

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.