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AS29F040 Datasheet(PDF) 1 Page - Micross Components |
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AS29F040 Datasheet(HTML) 1 Page - Micross Components |
1 / 27 page FLASH AS29F040 Micross Components reserves the right to change products or specifications without notice. 1 AS29F040 Rev. 2.3 01/10 512K x 8 FLASH UNIFORM SECTOR 5.0V FLASH MEMORY AVAILABLE AS MILITARY SPECIFICATIONS • MIL-STD-883 • SMD 5962-96692 FEATURES • Single 5.0V ±10% power supply operation • Fastest access times: 55, 60, 70, 90, 120, & 150ns • Low power consumption: 20 mA typical active read current 30 mA typical program/erase current 1 μA typical standby current (standard access time to active mode) • Flexible sector architecture Eight uniform 64 Kbyte each Any combination of sectors can be erased Supports full chip erase • Sector protection • Embedded Algorithms Erase & Program Algorithms • Erase Suspend/Resume • Minimum 1,000,000 Program/Erase Cycles per sector guaranteed • Compatible with JEDEC standards Pinout and software compatible with single-power- supply FLASH • Data\ Polling and Toggle Bits • 20-year data retention at 125°C For more products and information please visit our web site at www.micross.com PIN ASSIGNMENT (Top View) 32-PIN Ceramic DIP (CW) 32-pin Flatpack (F) 32-pin Lead Formed Flatpack (DCG) A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS VCC WE\ A17 A14 A13 A8 A9 A11 OE\ A10 CE\ DQ7 DQ6 DQ5 DQ4 DQ3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OPTIONS MARKING • Timing 55ns -55 60ns -60 70ns -70 90ns -90 120ns -120 150ns -150 OPTIONS MARKING • Package Type Ceramic DIP (600 mil) CW Flatpack F Lead Formed Flatpack DCG Leadless Chip Carrier ECA • Temperature Ranges Industrial Temperature (-40°C to +85°C) IT Military Temperature (-55°C to +125°C) XT** 883C Processing (-55°C to +125°C) 883C QML Processing (-55°C to +125°C) Q 4 3 2 32 31 30 14 15 16 17 18 19 20 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 A14 A13 A8 A9 A11 OE\ A10 CE\ I/O 7 1 32-PAD Ceramic LCC (ECA) |
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