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RES-WL Datasheet(PDF) 1 Page - Ohmite Mfg. Co. |
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RES-WL Datasheet(HTML) 1 Page - Ohmite Mfg. Co. |
1 / 2 page 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com 50 characteristics Ceramic Core CeramTec Rubalit® 96% alumina End Caps Stainless steel, precision formed Leads Copper wire, 100% Sn (Lead Free) coated Resistance Wire CN49W alloy TC ±20ppm/°C Encapsulation SUMICON 1100/1200 Epoxy molding compound for IC encapsulation Standard Tolerance F (1.0%), J (5.0%) Temperature Coefficient ±300ppm/°C for ≤0.03Ω; ±100ppm/°C for ≥0.033Ω Maximum Working Voltage √PxR WL series Miniature Wirewound Current Sense Type Power Rating (watts) Resistance Range ( Ω) WLA 0.5 0.005-0.100 WLB 1 0.005-0.100 WLC 2 0.010-0.100 Test Conditions Of Test Performance Thermal Shock Rated power applied until thermal stability, -55°C +0°C,-5°C,15min. ±2.0% Short-time Overload 5 times rated wattage for 5 seconds ±2.0% Solderability Method 208 of MIL-STD-202 ±2.0% Terminal Strength Pull test:10 pounds, 5 to10 seconds, Twist test: 1080°, 5 second/rotation ±1.0% Dielectric Withstanding Voltage 500 Volts rms for 1W. 1 minute ±1.0% High Temperature Exposure Exposed to an ambient temperature of 275 +5/-0°C for 250 ±8 hours, ±5.0% Moisture Resistance MIL-STD-202 Method 106, 7b not applicable ±2.0% Low Temperature Storage Cold chamber at a temperature of -65 ±2°C for 24 ±4 hours ±2.0% Vibration, High Frequency Frequency varied 10 to 2000Hz, 200G peak, 2 directions 6 hours each ±1.0% Load Life 1000/2000 hours at rated power, +25°C, 1.5 hours “On”, 0.5 hours “Off” ±5.0% 100 Ambient Temperature, ϒC 60 20 0 80 40 25 50 100 175 75 0 125 150 Fea tures •Ultra-lowohmicvalueseriesforCurrentSensing applications •Verylowinductance(<1nHat1MHzTest) •Miniaturizeddimensions,Betterpowertodimen- sionratios •Useofthehighestqualitystandard(96%Alumina) ceramiccore •Manufacturingprocess–Wirewinding/Spot Welding–byComputerNumericalControl(CNC) machinetoolstoensureconsistencyofproduct quality. •Encapsulatedbyepoxymoldingcompound •AdvancedICencapsulationmold/dietechnologies Derating P er FO r M a N ce D ata series s P eci F icati ON s (continued) |
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