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IXDF404SI Datasheet(PDF) 9 Page - IXYS Corporation |
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IXDF404SI Datasheet(HTML) 9 Page - IXYS Corporation |
9 / 10 page 9 IXDN404PI / N404SI / N404SI-16 IXDI404PI / I404SI / I404SI-16 IXDF404PI / F404SI / F404SI-16 PIN CONFIGURATIONS 1 2 3 4 5 6 7 8 IN A GND INB OUT A V S OUT B NC NC 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDN404 1 2 3 4 5 6 7 8 IN A GND INB OUT A V S OUT B NC NC 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDI404 16 Pin SOIC IXDN404SI-16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC IN A NC GND GND NC IN B NC NC OUT B OUT B VCC VCC OUT A OUT A NC 1 2 3 4 5 6 7 8 IN A GND INB OUT A V S OUT B NC NC 8 Lead PDIP (PI) 8 Pin SOIC (SI) IXDF404 16 Pin SOIC IXDI404SI-16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC IN A NC GND GND NC IN B NC NC OUT B OUT B VCC VCC OUT A OUT A NC 16 Pin SOIC IXDF404SI-16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NC IN A NC GND GND NC IN B NC NC OUT B OUT B VCC VCC OUT A OUT A NC When designing a circuit to drive a high speed MOSFET utilizing the IXDN404/IXDI404/IXDF404, it is very important to observe certain design criteria in order to optimize performance of the driver. Particular attention needs to be paid to Supply Bypassing, Grounding, and minimizing the Output Lead Inductance. Say, for example, we are using the IXDN404 to charge a 2500pF capacitive load from 0 to 25 volts in 25ns. Using the formula: I= ∆V C / ∆t, where ∆V=25V C=2500pF & ∆t=25ns, we can determine that to charge 2500pF to 25 volts in 25ns will take a constant current of 2.5A. (In reality, the charging current won’t be constant, and will peak somewhere around 4A). SUPPLYBYPASSING In order for our design to turn the load on properly, the IXDN404 must be able to draw this 2.5A of current from the power supply in the 25ns. This means that there must be very low impedance between the driver and the power supply. The most common method of achieving this low impedance is to bypass the power supply at the driver with a capacitance value that is a magnitude larger than the load capacitance. Usually, this would be achieved by placing two different types of bypassing capacitors, with complementary impedance curves, very close to the driver itself. (These capacitors should be carefully selected, low inductance, low resistance, high-pulse current-service capacitors). Lead lengths may radiate at high frequency due to inductance, so care should be taken to keep the lengths of the leads between these bypass capacitors and the IXDN404 to an absolute minimum. GROUNDING In order for the design to turn the load off properly, the IXDN404 must be able to drain this 2.5A of current into an adequate grounding system. There are three paths for returning current that need to be considered: Path #1 is between the IXDN404 and its load. Path #2 is between the IXDN404 and its power supply. Path #3 is between the IXDN404 and whatever logic is driving it. All three of these paths should be as low in resistance and inductance as possible, and thus as short as practical. In addition, every effort should be made to keep these three ground paths distinctly separate. Otherwise, the returning ground current from the load may develop a voltage that would have a detrimental effect on the logic line driving the IXDN404. OUTPUTLEADINDUCTANCE Of equal importance to Supply Bypassing and Grounding are issues related to the Output Lead Inductance. Every effort should be made to keep the leads between the driver and its load as short and wide as possible. If the driver must be placed farther than 2” (5mm) from the load, then the output leads should be treated as transmission lines. In this case, a twisted- pair should be considered, and the return line of each twisted pair should be placed as close as possible to the ground pin of the driver, and connected directly to the ground terminal of the load. Supply Bypassing, Grounding Practices And Output Lead inductance |
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