2

Application Support Information

The Application Engineering

group in Agilent Technologies is

available to assist you with the

technical understanding

Order Information

Part Number

Packaging Type

Package

Quantity

HSDL-3208-021

Tape and Reel

Front View

2500

Recommended Application Circuit Components

Component

Recommended Value

Notes

R1

2.7

CX1

0.47

µF ± 20%, X7R Ceramic

8

CX2

6.8

µF ± 20%, Tantalum

9

Notes:

8. CX1 must be placed within 0.7 cm of the HSDL-3208 to obtain optimum noise immunity.

9. In environments with noisy power supplies, supply rejection performance can be enhanced

by including CX2, as shown in “Figure 1: HSDL-3208 Functional Block Diagram” in Page 1.

associated with HSDL-3208

infrared transceiver module. You

can contact them through your

local Agilent sales representatives

for additional details.

I/O Pins Configuration Table

Pin

Symbol

Description

I/O Type

Notes

1

LED A

LED Anode

Input

1

2

LED C

LED Cathode

Input

2

3

TXD

Transmit Data

Input, Active High

3

4

RXD

Receive Data

Output, Active Low

4

5

SD/Mode

Shutdown

Input, Active High

5

Supply Voltage

Supply Voltage

6

7

GND

Ground

Ground

7

Notes:

2. Internally connected to the LED driver.

3. This pin is used to transmit serial data when SD pin is low. Do not float the pin.

4. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull down resistor is required. It is in tri-state

mode when the transceiver is in shutdown mode.

5. The transceiver is in shutdown mode if this pin is high. Do not float the pin.

6. Regulated, 2.7 to 3.6 volts.

7. Connect to system ground.