MC74HC595A

www.onsemi.com

11

PACKAGE DIMENSIONS

TSSOP−16

CASE 948F

ISSUE B

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

A

4.90

5.10

0.193

0.200

B

4.30

4.50

0.169

0.177

C

−−−

1.20

−−−

0.047

D

0.05

0.15

0.002

0.006

F

0.50

0.75

0.020

0.030

G

0.65 BSC

0.026 BSC

H

0.18

0.28

0.007

0.011

J

0.09

0.20

0.004

0.008

J1

0.09

0.16

0.004

0.006

K

0.19

0.30

0.007

0.012

K1

0.19

0.25

0.007

0.010

L

6.40 BSC

0.252 BSC

M

0

8

0

8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH. PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

___

_

SECTION N−N

SEATING

PLANE

IDENT.

PIN 1

1

8

16

9

DETAIL E

J

J1

B

C

D

A

K

K1

H

G

DETAIL E

F

M

L

2X

L/2

−U−

S

U

0.15 (0.006) T

S

U

0.15 (0.006) T

S

U

M

0.10 (0.004)

T

0.10 (0.004)

−T−

−V−

−W−

0.25 (0.010)

16X

REF

K

N

N

7.06

16X

0.36

16X

1.26

0.65

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.