IN to PGND (Note 2) .............................................-0.3V to +48V

EN to SGND (Note 2)............................................-0.3V to +48V

FB, RESET, SS, CF, MODE,

SYNC, RT to SGND .........................................-0.3V to +6.5V

BST to PGND........................................................-0.3V to +53V

BST to LX.............................................................-0.3V to +6.5V

Operating Temperature Range......................... -40°C to +125°C

Junction Temperature......................................................+125°C

Storage Temperature Range............................ -65°C to +125°C

Lead Temperature (soldering, 10s) .................................+245°C

(Note 3)

Electrical Characteristics

are referenced to SGND, unless otherwise noted.) (Note 4)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

IN Input Voltage Range

4.5

42

V

Input Shutdown Current

10.5

13

μA

Input Quiescent Current

HIB

MODE = RT = open

125

μA

1.16

1.8

mA

Normal switching mode, no load

9.5

mA

LOGIC INPUTS

EN Threshold

1.192

1.215

1.26

V

1.068

1.09

1.131

V

Enable Pullup Resistor

Pullup resistor between IN and EN pins

3.15

3.3

3.45

MΩ

LDO

4.75

5

5.25

V

26.5

60

100

mA

4.2

V

4.05

4.2

4.3

V

3.65

3.8

3.9

V

MAXM17544

4.5V to 42V, 3.5A High-Efficiency, DC-DC Step-

Down Power Module with Integrated Inductor

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: SGND and PGND are internally connected.

Note 2: See Pin Description for the connection of the backside exposed pad.

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings (Notes 1, 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics