MC74VHC541

http://onsemi.com

4

*Includes all probe and jig capacitance

TEST

POINT

DEVICE

UNDER

TEST

OUTPUT

TEST CIRCUITS

Figure 4.

*Includes all probe and jig capacitance

TEST

POINT

DEVICE

UNDER

TEST

OUTPUT

1k

W

CONNECT TO GND WHEN

Figure 5.

Figure 6. Input Equivalent Circuit

INPUT

ORDERING INFORMATION

Device

Package

MC74VHC541DWR2G

SOIC−20WB

(Pb−Free)

1000 / Tape & Reel

MC74VHC541DTG

TSSOP−20

(Pb−Free)

75 Units / Rail

MC74VHC541DTR2G

TSSOP−20

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MARKING DIAGRAMS

TSSOP−20

SOIC−20WB

20

1

VHC541

AWLYYWWG

20

1

VHC

541

ALYW

G

G

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

G or

G = Pb−Free Package

(Note: Microdot may be in either location)