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EM63B165TS-6ISG Datasheet(PDF) 1 Page - Etron Technology, Inc. |
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EM63B165TS-6ISG Datasheet(HTML) 1 Page - Etron Technology, Inc. |
1 / 53 page EtronTech EM63B165TS Etron Technology, Inc. No. 6, Technology Rd. V, Hsinchu Science Park, Hsinchu, Taiwan 30078, R.O.C. TEL: (886)-3-5782345 FAX: (886)-3-5778671 Etron Technology, Inc. reserves the right to change products or specification without notice. 32M x 16 bit Synchronous DRAM (SDRAM) Advance (Rev. 2.0, Jun. /2016) Features Fast access time from clock: 4.5/5/5.4 ns Fast clock rate: 200/166/143 MHz Fully synchronous operation Internal pipelined architecture 8M word x 16-bit x 4-bank Programmable Mode registers - CAS Latency: 2 or 3 - Burst Length: 1, 2, 4, 8, or full page - Burst Type: Sequential or Interleaved - Burst stop function Auto Refresh and Self Refresh 8192 refresh cycles/64ms CKE power down mode Single +3.3V ±0.3V power supply Industrial Temperature: TA = -40~85°C Interface: LVTTL 54-pin 400 mil plastic TSOP II package - Pb free and Halogen free Table 1. Key Specifications Table 2. Ordering Information Overview The EM63B165 SDRAM is a high-speed CMOS synchronous DRAM containing 512 Mbits. It is internally configured as 4 Banks of 8M word x 16 DRAM with a synchronous interface (all signals are registered on the positive edge of the clock signal, CLK). Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of a Bank Activate command which is then followed by a Read or Write command. The EM63B165 provides for programmable Read or Write burst lengths of 1, 2, 4, 8, or full page, with a burst termination option. An auto precharge function may be enabled to provide a self-timed row precharge that is initiated at the end of the burst sequence. The refresh functions, either Auto or Self Refresh are easy to use. By having a programmable mode register, the system can choose the most suitable modes to maximize its performance. These devices are well suited for applications requiring high memory bandwidth and particularly well suited to high performance PC applications. EM63B165 -5I/6I/7I tCK3 Clock Cycle time(min.) 5/6/7 ns tAC3 Access time from CLK (max.) 4.5/5/5.4 ns tRAS Row Active time(min.) 40/42/42 ns tRC Row Cycle time(min.) 55/60/63 ns Part Number Frequency Package EM63B165TS-5ISG 200MHz TSOP II EM63B165TS-6ISG 166MHz TSOP II EM63B165TS-7ISG 143MHz TSOP II TS: indicates TSOPII Package I: indicates Industrial Grade S: indicates Stacked Dice G: indicates Pb and Halogen Free |
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