SIGC109T120R3LE

L7688N, L7688U, L7688F

7

Rev. 2.3, 19.08.2015

Bare Die Product Specifics

Test coverage at wafer level cannot cover all application conditions. Therefore it is recommended to test all

characteristics which are relevant for the application at package level, including RBSOA and SCSOA.

Description

AQL 0.65 for visual inspection according to failure catalogue

Electrostatic Discharge Sensitive Device according to MIL-STD 883

Revision History

Revision

Subjects (major changes since last revision)

Date

2.0

Release of final datasheet, change wafer size to 200mm

30.04.2010

2.1

Additional basic types L7688N, L7688U, L7688F; new gate pad design

01.07.2014

2.2

Minor changes, chip drawing

06.02.2015

2.3

Update disclaimer

19.08.2015

Relevant Application Notes