Body remperature should follow the description below:

MKP capacitor

≤ 110 °C

≤ 120 °C, t

s

≤ 45 s

MKT capacitor

≤ 125 °C

≤ 160 °C, t

s

≤ 45 s

When SMD components are used together with leaded ones, the film capacitors should not pass

into the SMD adhesive curing oven. The leaded components should be assembled after the SMD

curing step.

Leaded film capacitors are not suitable for reflow soldering.

For uncoated MKT capacitors with lead spacings

≤10 mm (B32560/B32561) the following mea-

sures are recommended:

pre-heating to not more than 110

°C in the preheater phase

rapid cooling after soldering

Please refer to EPCOS Film Capacitor Data Book in case more details are needed.

B32932 ... B32936

AC applications (heavy duty series) / 305 V AC

Page 11 of 18

Please read Cautions and warnings and

Important notes at the end of this document.