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KTY82-210 Datasheet(PDF) 10 Page - NXP Semiconductors |
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KTY82-210 Datasheet(HTML) 10 Page - NXP Semiconductors |
10 / 16 page 1998 Mar 26 10 Philips Semiconductors Product specification Silicon temperature sensors KTY82-2 series PACKAGING Tape specification Sensors in SOT23 encapsulation are delivered in reel packaging for automatic placement on hybrid circuits and printed-circuit boards. The devices are placed with the mounting side downwards in the compartments. Fig.7 Configuration of bandolier. Dimension in mm. (1) Tolerance over any 10 pitches: ±0.2 mm. handbook, full pagewidth MBB570 - 2 ,, ,, ,, ,, ,, ,, ,, , , , , , 1.75 0.1 0.75 min 3.5 0.05 5.5 0.25 8 0.2 0.2 component 1.5 0.1 0 4.0 0.1 2.0 0.1 4.0 0.1(1) direction of unreeling 0.4 max 3.3 max 1.0 min 1.5 max |
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