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NL17SZ16DFT2G Datasheet(PDF) 2 Page - ON Semiconductor |
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NL17SZ16DFT2G Datasheet(HTML) 2 Page - ON Semiconductor |
2 / 6 page NL17SZ16 www.onsemi.com 2 MAXIMUM RATINGS Symbol Parameter Value Units VCC DC Supply Voltage −0.5 to +7.0 V VI DC Input Voltage Output in High or Low State (Note 2) −0.5 ≤ VI ≤ +7.0 V VO DC Output Voltage VI < GND −0.5 ≤ VO ≤ +7.0 V IIK DC Input Diode Current VO < GND −50 mA IOK DC Output Diode Current −50 mA IOUT DC Output Sink Current ±50 mA ICC DC Supply Current per Supply Pin ±100 mA IGND DC Ground per Supply Pin ±100 mA TSTG Storage Temperature Range −65 to +150 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction Temperature Under Bias +150 °C qJA Thermal Resistance SOT−353 SOT−553 350 360 °C/W PD Power Dissipation in Still Air at 85 °C SOT−353 SOT−553 150 180 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in ESD ESD Classification Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note 5) 2000 200 N/A V ILatchup Latchup Performance Above VCC and Below GND at 85°C (Note 6) $100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow. 2. IO Absolute Maximum Rating Must be Obtained. 3. Tested to EIA/JESD22−A114−A, rated to EIA/JESD22−A114−B. 4. Tested to EIA/JESD22−A115−A, rated to EIA/JESD22−A115−A. 5. Tested to JESD22−C101−A. 6. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Units VCC DC Supply Voltage Operations Only Data Retention 1.65 1.5 5.5 5.5 V VIN DC Input Voltage 0 5.5 V VOUT DC Output Voltage 0 5.5 V TA Operating Temperature Range −55 +125 °C tr, tf Input Rise and Fall Time VCC = 2.5 V ±0.2 V VCC = 3.0 V ±0.3 V VCC = 5.0 V ±0.5 V 0 0 0 20 10 5 ns/V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. |
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