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NCN8024DTBR2G Datasheet(PDF) 5 Page - ON Semiconductor |
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NCN8024DTBR2G Datasheet(HTML) 5 Page - ON Semiconductor |
5 / 16 page NCN8024 http://onsemi.com 5 ATTRIBUTES Characteristics Values ESD protection Human Body Model (HBM) (Note 1) Card Pins (Card Interface Pins 9 − 17) All Other Pins Machine Model (MM) Card Pins (Card Interface Pins 9 − 17) All Other Pins 8 kV 2 kV 400 V 150 V Moisture sensitivity (Note 2) SOIC−28 and TSSOP−28 Level 3 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Meets or exceeds JEDEC Spec EIA/JESD78 IC Latch−up Test 1. Human Body Model (HBM), R = 1500 W, C = 100 pF. 2. For additional information, see Application Note AND8003/D. MAXIMUM RATINGS (Note 3) Rating Symbol Value Unit DC/DC Converter Power Supply Voltage VDDP −0.3 v VDDP v 5.5 V Power Supply from Microcontroller Side VDD −0.3 v VDD v 5.5 V External Card Power Supply CRD_VCC −0.3 v CRD_VCC v 5.5 V Charge Pump Output VUP −0.3 v VUP v 5.5 Digital Input Pins Vin −0.3 v Vin v VDD V Digital Output Pins (I/Ouc, AUX1uc, AUX2uc, INT) Vout −0.3 v Vout v VDD V Smart Card Output Pins Vout −0.3 v Vout v CRD_VCC V Thermal Resistance Junction−to−Air SOIC−28 TSSOP−28 RqJA 75 76 °C/W Operating Ambient Temperature Range TA −40 to +85 °C Operating Junction Temperature Range TJ −40 to +125 °C Maximum Junction Temperature TJmax +125 °C Storage Temperature Range Tstg −65 to + 150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 3. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C |
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