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BSS806NE Datasheet(PDF) 2 Page - Infineon Technologies AG |
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BSS806NE Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 9 page BSS806NE Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - ambient R thJA minimal footprint 1) - - 250 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS= 0 V, I D= 250 µA 20 - - V Gate threshold voltage V GS(th) V DS=VGS , I D=11 µA 0.3 0.55 0.75 Drain-source leakage current I DSS V DS=20 V, V GS=0 V, T j=25 °C - - 1 mA V DS=20 V, V GS=0 V, T j=150 °C - - 100 Gate-source leakage current I GSS V GS=8 V, V DS=0 V - - 6 µA Drain-source on-state resistance R DS(on) V GS=1.8 V, I D=1.3 A - 57 82 m W V GS=2.5 V, I D=2.3 A - 41 57 Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=1.9 A 9 - S Values 1) Performed on 40mm2 FR4 PCB. The traces are 1mm wide, 70μm thick and 20mm long; they are present on both sides of the PCB. Rev 2.01 page 2 2014-01-16 |
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