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WS3442 Datasheet(PDF) 7 Page - List of Unclassifed Manufacturers |
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WS3442 Datasheet(HTML) 7 Page - List of Unclassifed Manufacturers |
7 / 10 page www.winsemi.com Tel : +86-755-8250 6288 Fax : +86-755-8250 6299 7/10 WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS WINSEMI MICROELECTRONICS WS3442 ProductDescription And then the Rovp resistor value can be calculated by the equation: 6 3.3* *10 Rovp Tovp ( kohm) Protection Function The WS3442 offers rich protection functions to improve the system reliability, including LED open/short protection, CS resistor short protection, VCC under voltage protection, thermal regulation. When the LED is open circuit, the system will trigger the over voltage protection and stop switching. When the LED short circuit is detected, the system works at low frequency (5kHz), and the CS pin turn off threshold is reduced to 200mV. So the system power consumption is very low. At some catastrophic fault condition, such as CS resistor shorted or inductor saturated, the internal fast fault detection circuit will be triggered, the system stops switching immediately. After the system enters into fault condition, the VCC voltage will decrease until it reaches the UVLO threshold, then the system will re-start again. If the fault condition is removed, the system will recover to normal operation. Thermal Regulation The WS3442 integrates thermal regulation function. When the system is over temperature, the output current is gradually reduced; the output power and thermal dissipation are also reduced. The system temperature is regulated and the system reliability is improved. The thermal regulation temperature is set to 150℃ internally. PCB Layouts The following rules should be followed in WS3442 PCB layout: Vcc Capacitor The bypass capacitor on VCC pin should be as close as possible to the VCC Pin and GND pin. ROVP Pin The ROVP resistor should be as close as possible to the ROVP Pin. Ground Path The power ground path for current sense should be short, and the power ground path should be separated from small signal ground path before connecting to the negative node of the bulk capacitor. The Area of Power Loop The area of main current loop should be as small as possible to reduce EMI radiation, such as the inductor, the power MOSFET, the output diode and the bus capacitor loop. NC pin The NC pin should be connected to GND (pin1). Drain Pin To increase the copper area of DRAIN pin for better thermal dissipation. However too large copper area may compromise EMI performance. The material of PCB Avoid choosing the material that is easy to absorb the moisture, just like paper copper-clad laminates. |
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