NLAS1053

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10

PACKAGE DIMENSIONS

US8

US SUFFIX

CASE 493−02

ISSUE D

0.30

8X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.50

RECOMMENDED

1

PITCH

3.40

0.68

8X

DIM

A

MIN

MAX

MIN

MAX

INCHES

1.90

2.10

0.075

0.083

MILLIMETERS

B

2.20

2.40

0.087

0.094

C

0.60

0.90

0.024

0.035

D

0.17

0.25

0.007

0.010

F

0.20

0.35

0.008

0.014

G

0.50 BSC

0.020 BSC

H

0.40 REF

0.016 REF

J

0.10

0.18

0.004

0.007

K

0.00

0.10

0.000

0.004

L

3.00

3.20

0.118

0.128

M

0

6

0

6

N

0

10

0

10

P

0.23

0.34

0.010

0.013

R

0.23

0.33

0.009

0.013

S

0.37

0.47

0.015

0.019

U

0.60

0.80

0.024

0.031

V

0.12 BSC

0.005 BSC

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURR. MOLD

FLASH. PROTRUSION AND GATE BURR SHALL

NOT EXCEED 0.14MM (0.0055”) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH

AND PROTRUSION SHALL NOT EXCEED 0.14MM

(0.0055”) PER SIDE.

5. LEAD FINISH IS SOLDER PLATING WITH

THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).

6. ALL TOLERANCE UNLESS OTHERWISE

SPECIFIED

±0.0508MM (0.0002”).

L

B

A

P

G

4

1

5

8

C

K

D

SEATING

J

S

R

U

DETAIL E

V

F

H

N

R 0.10 TYP

M

DETAIL E

T

M

0.10 (0.004)

XY

T

0.10 (0.004)

__

__

__

__

PLANE

X Y

T

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Japan Customer Focus Center

Phone: 81−3−5817−1050

NLAS1053/D

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