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MB10F Datasheet(PDF) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
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MB10F Datasheet(HTML) 1 Page - Chongqing Pingwei Enterprise co.,Ltd |
1 / 2 page 1 MB2F THRU MB10F SINGLE PHASE1.0AMPS. GLASS PASSIVATED BRIDGE RECTIFIERS FEATURE . Glass passivated junction. . Ideal for printed circuit board. . Reliable low cost construction utilizing molded plastic technique. . High surge current capability. . High temperature soldering guaranteed: 260℃/10 seconds at terminals. MECHANICAL DATA . Case Material: “Green” Molding compound, UL flammability classification rating 94V-0, “Free halogen” . Moisture sensitivity level:level 2a,per J-STD-020 . Polarity:Polarity as marked on the body . Weight: 0.105g (approximately) MBF - + .177(4.5) .0 20(0.5) .09 1(2.3) .193(4.9) .106(2.7) .036(0.9) + - .165(4.2) .276(7.0)M AX .043(1.1) .150(3.8) .012(0.3) .008(0.2) .020(0.5) .031(0.8) .01 6(0.4) .008(0.2)M AX .05 1(1.3) .059(1.5) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25℃ ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,resistive or inductive load. For capacitive load, derate current by 20% Type Number SYM BOL MB2F MB4F MB6F MB8F MB10F units Maximum Recurrent Peak Reverse Voltage VRRM 200 400 600 800 1000 V Maximum RMS Voltage VRMS 140 280 420 560 700 V Maximum DC blocking Voltage VDC 200 400 600 800 1000 V Maximum Average Forward rectified Current @ TA=40℃ IF(AV) 1.0 A Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rate load (JEDEC method) IFSM 30 A Maximum Instantaneous @ IF =1.0A DC Forward Voltage @ IF = 0.5A DC VF 1.1 0.95 V Maximum DC Reverse Current @TJ =25°C at rated DC blocking voltage @TJ =125°C IR 5.0 100.0 μA I2t Rating for Fusing (t﹤8.3ms) I2t 3.74 A2Sec Typical Junction Capacitance Per Leg (Note1) CJ 13 pF Typical Thermal Resistance (Note2) RJC RJA 25 85 °C /W Storage Temperature TSTG -55 to +150 °C Operating Junction Temperature TJ -55 to +150 °C Note: 1. Measured at 1.0 MHz and applied reverse voltage of 4.0Vdc 2. Thermal resistance junction to case, lead and ambient in accordance with JESD-51. Unit mounted on glass-epoxy substrate with 1oz/ft2_10x10 mm copper pad per pin with heatsink |
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