28-Lead PLCC Package Outline (PJ)

.453x.453in. body, .180in. height (max), .050in. pitch

Symbol

A

A1

A2

b

b1

D

D1

E

E1

e

R

Dimension

(inches)

MIN

.165

.090

.062

.013

.026

.485

.450

.485

.450

.050

BSC

.025

NOM

.172

.105

-

-

-

.490

.453

.490

.453

.035

MAX

.180

.120

.083

.021

.032

.495

.456

.495

.456

.045

JEDEC Registration MS-018, Variation AB, Issue A, June, 1993.

Drawings not to scale.

.150 MAX

.048/.042

1

075 MAX

4

26

D

D1

E1

E

Top View

View A

A

A2

A1

Seating

Plane

e

Note 1

(Index Area)

.056/.042

x 45

O

Base

Plane

.020 MIN

28

b

View A

b1

Horizontal Side View

Vertical Side View

Note 2

.020max

(3 Places)

R

Notes:

1.

a printed indicator.

2.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.

HV5812

DS20005629A-page 10

 2016 Microchip Technology Inc.