MC12093

www.onsemi.com

2

Figure 2. AC Test Circuit

SB

SW1

SW2

OUT

GND

C4

IN

IN

50

W

C2

C1

C3

EXTERNAL

COMPONENTS

C1 = C2 = 1000 pF

C3 = 0.1

mF

C4 = 2.0 pF Load

Table 2. ATTRIBUTES

Characteristics

Value

Internal Input Pulldown Resistor

N/A

Internal Input Pullup Resistor

N/A

ESD Protection

Human Body Model

Machine Model

Charged Device Model

> 4 kV

> 200 V

> 2 kV

Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)

Pb-Free Pkg

SOIC−8 NB

DFN8

Level 1

Level 1

Flammability Rating

Oxygen Index: 28 to 34

UL 94 V−0 @ 0.125 in

Transistor Count

125 Devices

Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test

1. For additional information, see Application Note AND8003/D.

Table 3. MAXIMUM RATINGS

Symbol

Rating

Value

Unit

Power Supply Voltage, Pin 2

−0.5 to 6.0

Vdc

Operating Temperature Range

−40 to 85

°C

Storage Temperature Range

−65 to 150

°C

Maximum Output Current, Pin 4

4.0

mA

Thermal Resistance (Junction-to-Case) (Note 1) DFN8

35 to 40

°C/W

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

NOTE: ESD data available upon request.

1. JEDEC standard multilayer board − 2S2P (2 signal, 2 power). For DFN8 only, thermal exposed pad must be connected to a sufficient thermal

conduit. Electrically connect to the most negative supply (GND) or leave unconnected, floating open.