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MIC2168A Datasheet(PDF) 3 Page - Micrel Semiconductor |
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MIC2168A Datasheet(HTML) 3 Page - Micrel Semiconductor |
3 / 18 page Micrel, Inc. MIC2168A Absolute Maximum Ratings (1) Supply Voltage (VIN) ..................................................+15.5V Bootstrapped Voltage (VBST). ................................... VIN +5V Junction Temperature (TJ) ..................– 40°C ≤ T J ≤ +125°C Storage Temperature (TS).........................–65°C to +150°C Operating Ratings (2) Supply Voltage (VIN)...................................... +3V to +14.5V Output Voltage Range............................. 0.8V to VIN × DMAX Package Thermal Resistance 10-Pin MSOP ( θ JA)........................................... 180°C/W Electrical Characteristics (3) TJ = 25°C, VIN = 5V, unless otherwise specified. Bold values indicate –40°C < TJ < +125°C. Parameter Condition Min. Typ. Max. Units Feedback Voltage Reference (± 1%) 0.792 0.8 0.808 V Feedback Voltage Reference (± 2% over temp) 0.784 0.8 0.816 V Feedback Bias Current 30 100 nA Output Voltage Line Regulation 0.03 %/V Output Voltage Load Regulation 0.5 % Output Voltage Total Regulation 3V ≤ VIN ≤ 14.5V; 1A ≤ IOUT ≤ 10A; (VOUT = 2.5V)(4) 0.6 % Oscillator Section Oscillator Frequency 900 1000 1100 kHz Maximum Duty Cycle (DMAX) 90 Minimum On-Time (4) 30 60 ns Input and VDD Supply PWM Mode Supply Current VCS = VIN –0.25V; VFB = 0.7V (output switching but excluding external MOSFET gate current.) 1.6 3 mA Shutdown Quiescent Current VCOMP/EN=0V 50 150 µA VCOMP Shutdown Threshold 0.1 0.25 0.4 V VCOMP Shutdown Blanking Period CCOMP = 100nF 4 ms Digital Supply Voltage (VDD) VIN ≥ 6V 4.7 5 5.3 V Error Amplifier DC Gain 70 dB Transconductance 1 ms Soft Start Soft-Start Current After timeout of internal timer. (See “Soft-Start” section.) 8.5 µA Current Sense CS Overcurrent Trip Point VCS = VIN –0.25V 160 200 240 µA Temperature Coefficient +1800 ppm/°C Notes: 1. Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to- ambient thermal resistance, θ JA, and the ambient temperature, TA. The maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. 2. Devices are ESD sensitive, handling precautions required. 3. Specification for packaged product only. 4. Guaranteed by design. April 22, 2015 3 Revision 3.0 |
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