MIC2125/6

DS20005459B-page 6

 2015 Microchip Technology Inc.

TEMPERATURE SPECIFICATIONS

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Operating Temperature

–40

—

+125

°C

Note 1

Storage Temperature Range

–65

—

+150

°C

—

Junction Temperature

—

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance 3 mm x 3 mm

QFN-16LD

—50.8

—

°C/W

—

—25.3

—

°C/W

—

Note 1:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.