Figure 1. Eye diagram results from the ADS Transient-Convolution Simulator show excellent

correlation with measurements, enabling rapid “what if” design space exploration.

The Keysight EEsof EDA—the technology and innovation leader in high-speed,

high-frequency electronic design automation—takes SPICE to a new level with

the ADS Transient Convolution Element. This simulator is the industry’s fastest

signal integrity circuit simulator for multigigabit, high-speed data link design.

Multicore processor support and a new, high-capacity sparse matrix solver

achieves a three-fold simulation speed improvement for signal integrity simula-

tions.

Design and verification of chip-to-chip multigigabit/s serial links is the morst

common application for the Transient Convolution Element. At the very high

data rates at which these links operate, signal integrity engineers must take into

account physical phenomena such as impedance mismatch, reflections, elec-

tromagnetic coupling, crosstalk and microwave frequency attenuation due to

the skin effect and dielectric loss tangent. The simulator allows signal integrity

engineers to perform “what-if” design space exploration using a circuit-level

model that can be verified against measured data, and electromagnetic simula-

tion on the post-layout artwork to arrive at an optimum design while avoiding

costly and time consuming prototype iterations.

Introduction