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TPS54312 Datasheet(PDF) 11 Page - Texas Instruments |
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TPS54312 Datasheet(HTML) 11 Page - Texas Instruments |
11 / 21 page Minimum Recommended Exposed Copper Area For Powerpad. 5mm Stencils may Require 10 Percent Larger Area 0.2454 0.0150 0.06 0.0256 0.1700 0.1340 0.0620 0.0400 0.0400 0.0400 0.0600 0.0227 0.0600 0.1010 6 PL ∅ 0.0130 4 PL ∅ 0.0180 Connect Pin 1 to Analog Ground Plane in This Area for Optimum Performance Minimum Recommended Top Side Analog Ground Area Minimum Recommended Thermal Vias: 6 × .013 dia. Inside Powerpad Area 4 × .018 dia. Under Device as Shown. Additional .018 dia. Vias May be Used if Top Side Analog Ground Area is Extended. 0.2560 TPS54310-EP www.ti.com ..................................................................................................................................................................................................... SLVS818 – APRIL 2008 Figure 12. Recommended Land Pattern for 20-Pin PWP PowerPAD Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): TPS54310-EP |
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