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RT9168A-23CBR Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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RT9168A-23CBR Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers |
9 / 13 page RT9168/A DS9168/A-03 May 2001 www.richtek-ic.com.tw 9 indefinite amount of time without damaging the part by cooperation of current limit and thermal protection. Operating Region and Power Dissipation The maximum power dissipation of RT9168/A depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the device is P = IOUT (VIN - VOUT). The maximum power dissipation is: PMAX = (TJ - TA) / θJA where TJ - TA is the temperature difference between the RT9168/A die junction and the surrounding environment, θJA is the thermal resistance from the junction to the surrounding environment. The GND pin of the RT9168/A performs the dual function of providing an electrical connection to ground and channeling heat away. Connect the GND pin to ground using a large pad or ground plane. |
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