Datasheet

Datasheet

6/38

TSZ02201-0J3J0AL01130-1-2

21.Apr.2016 Rev.001

BD90521MUV-C / BD90521EFV-C

© 2016 ROHM Co., Ltd. All rights reserved.

www.rohm.com

TSZ22111 • 15 • 001

Absolute Maximum Ratings (Ta = 25°C)

Parameter

Symbol

Rating

Unit

Supply Voltage

-0.3 to 7

V

EN Pin Voltage

-0.3 to 7

V

SYNC Pin Voltage

V

SEL Pin Voltage

-0.3 to 7

V

FB Pin Voltage

V

COMP Pin Voltage

V

SS Pin Voltage

V

RT Pin Voltage

V

PGOOD Pin Voltage

-0.3 to 7

V

Maximum Junction Temperature

Tjmax

+150

°C

Storage Temperature Range

Tstg

-55 to +150

°C

ESD Rating (HBM)

±2000

V

Caution:

Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit

between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over

the absolute maximum ratings.

項目

Symbol

Thermal Resistance (Typ)

Unit

VQFN20SV4040

Junction to Ambient

153.9

37.4

°C / W

13

7

°C / W

HTSSOP-B20

Junction to Ambient

143.0

26.8

°C / W

8

4

°C / W

(Note 1) Based on JESD51-2A(Still-Air)

(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface

of the component package.

(Note 3) Using a PCB board based on JESD51-3.

Layer Number of

Measurement Board

Material

Board Size

Single

FR-4

114.3mm x 76.2mm x 1.57mmt

Top

Copper Pattern

Thickness

Footprints and Traces

70μm

(Note 4) Using a PCB board based on JESD51-5,7.

Layer Number of

Measurement Board

Material

Board Size

Pitch

Diameter

4 Layers

FR-4

114.3mm x 76.2mm x 1.6mmt

1.20mm

Φ0.30mm

Top

2 Internal Layers

Bottom

Copper Pattern

Thickness

Copper Pattern

Thickness

Copper Pattern

Thickness

Footprints and Traces

70

μm

74.2mm x 74.2mm

35

μm

74.2mm x 74.2mm

70

μm

(Note 5) This thermal via connects with the copper pattern of all layers.