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DSC2311KI1-R0002T Datasheet(PDF) 4 Page - Microchip Technology |
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DSC2311KI1-R0002T Datasheet(HTML) 4 Page - Microchip Technology |
4 / 18 page DSC2311 DS20005611A-page 4 2016 Microchip Technology Inc. TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges Operating Temperature Range (T) TA –20 — +70 °C Ordering Option E TA –40 — +85 °C Ordering Option I TA –40 — +105 °C Ordering Option L TA –40 — +125 °C Ordering Option M Junction Temperature TJ — — +150 °C — Storage Temperature Range TS –40 — +150 °C — Soldering Temperature Range — — — +260 °C 40 sec. max. Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature, and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. |
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