TPS65266-1 datasheet(5/37 Pages) TI1

Part #	TPS65266-1

Description	2.7 to 6-V Input Voltage, 3-A/2-A/2-A Output Current Triple Synchronous Step-Down Converter

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Manufacturer	TI1 [Texas Instruments]

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TPS65266-1

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SLVSDA6 – OCTOBER 2016

Product Folder Links: TPS65266-1

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(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1)

MIN

MAX

UNIT

Voltage at

VIN1, VIN2, VIN3, VINQ

–0.3

7

V

LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)

–1.0

7

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.3

7

EN1, EN2, EN3, PGOOD

–0.3

7

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC

–0.3

3.6

AGND, PGND1, PGND2, PGND3

–0.3

0.3

TJ

Operating junction temperature

–30

125

°C

Tstg

Storage temperature

–55

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)

±500

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Voltage at

VIN1, VIN2, VIN3, VINQ

2.7

6

V

LX1, LX2, LX3 (maximum withstand voltage transient <20 ns)

–0.8

6

BST1, BST2, BST3 referenced to LX1, LX2, LX3 pins respectively

–0.1

6

EN1, EN2, EN3, PGOOD

–0.1

6

FB1, FB2, FB3, COMP1 , COMP2, COMP3, SS1, SS2, SS3, ROSC

–0.1

3

TJ

Operating junction temperature

–30

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1)

TPS65266-1

UNIT

RHB

32-PIN VQFN

RθJA

Junction-to-ambient thermal resistance

34.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

27.5

°C/W

RθJB

Junction-to-board thermal resistance

8.3

°C/W

ψJT

Junction-to-top characterization parameter

0.4

°C/W

ψJB

Junction-to-board characterization parameter

8.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

2.8

°C/W

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