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CWR06CB155J Datasheet(PDF) 6 Page - Vishay Siliconix

Part # CWR06CB155J
Description  Solid Tantalum Chip Capacitors MIDGET Military, MIL-PRF-55365/4 Qualified
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

CWR06CB155J Datasheet(HTML) 6 Page - Vishay Siliconix

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138
CWR06
Vishay Sprague
Document Number 40009
Revision 16-Nov-04
For technical questions, contact tantalum@vishay.com
Case Code
Maximum Permissible
Power Dissipation
@ + 25
°C (Watts) in free air
A
B
C
D
E
F
G
H
0.060
0.075
0.075
0.085
0.095
0.110
0.120
0.150
in inches [millimetres]
REFLOW SOLDER PADS*
6.
Printed Circuit Board Materials: The CWR06 is
compatible with commonly used printed circuit board
materials (alumina substrates, FR4, FR5, G10, PTFE-
fluorocarbon and porcelainized steel). If you desire
other board materials, contact the factory for
availability.
7.
Attachment:
7.1
Solder Paste: The recommended thickness of the
solder paste after application is .007" ± .001"
[.178mm ± .025mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous state
of the solder.
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques - vapor phase,
infrared reflow, wave soldering and hot plate methods.
The Soldering Profile chart shows maximum
recomended time/temperature conditions for solder-
ing. Attachment with a soldering iron is not recom-
mended due to the difficulty of controlling temperature
and time at temperature.
8.
Cleaning (Flux Removal) After Soldering: The
CWR06 is compatible with all commonly used solvents
such as TES, TMS, Prelete, Chlorethane, Terpene
and aqueous cleaning media. However, CFC/ODS
products are not used in the production of these
devices and are not recommended. Solvents
containing methylene chloride or other epoxy solvents
should be avoided since these attack the epoxy
encapsulation material.
9
Recommended Mounting Pad Geometries: The
area under the tantalum wire nib should not be
metallized on the PC board. The width dimension
indicated is the same as the maximum width of the
capacitor. This is to minimize lateral movement.
250
200
150
100
50
TIME (SECONDS)
0
50
100
150
200
250
300
350
RECOMMENDED REFLOW SOLDERING PROFILE
GUIDE TO APPLICATION (Continued)
PAD
CASE
WIDTH
METALIZATION
SEPARATION
CODE
(A)
(B)
(C)
A
0.65
0.050
0.040
(1.6)
(1.3)
(1.0)
B
0.065
0.070
0.055
(1.6)
(1.8)
(1.4)
C
0.065
0.070
0.120
(1.6)
(1.8)
(0.3)
D
0.115
0.070
0.070
(2.9)
(1.8)
(1.8)
E
0.115
0.070
0.120
(2.9)
(1.8)
(3.0)
F
0.150
0.070
0.140
(3.8)
(1.8)
(3.6)
G
0.125
0.070
0.170
(3.2)
(1.8)
(4.3)
H
0.165
0.090
0.170
(4.2)
(2.3)
(4.3)
B
C
B
A


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