Electronic Components Datasheet Search |
|
CWR06CB155J Datasheet(PDF) 6 Page - Vishay Siliconix |
|
CWR06CB155J Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 7 page www.vishay.com 138 CWR06 Vishay Sprague Document Number 40009 Revision 16-Nov-04 For technical questions, contact tantalum@vishay.com Case Code Maximum Permissible Power Dissipation @ + 25 °C (Watts) in free air A B C D E F G H 0.060 0.075 0.075 0.085 0.095 0.110 0.120 0.150 in inches [millimetres] REFLOW SOLDER PADS* 6. Printed Circuit Board Materials: The CWR06 is compatible with commonly used printed circuit board materials (alumina substrates, FR4, FR5, G10, PTFE- fluorocarbon and porcelainized steel). If you desire other board materials, contact the factory for availability. 7. Attachment: 7.1 Solder Paste: The recommended thickness of the solder paste after application is .007" ± .001" [.178mm ± .025mm]. Care should be exercised in selecting the solder paste. The metal purity should be as high as practical. The flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. In practice this can be aided by extending the solder preheat time at temperatures below the liquidous state of the solder. 7.2 Soldering: Capacitors can be attached by conventional soldering techniques - vapor phase, infrared reflow, wave soldering and hot plate methods. The Soldering Profile chart shows maximum recomended time/temperature conditions for solder- ing. Attachment with a soldering iron is not recom- mended due to the difficulty of controlling temperature and time at temperature. 8. Cleaning (Flux Removal) After Soldering: The CWR06 is compatible with all commonly used solvents such as TES, TMS, Prelete, Chlorethane, Terpene and aqueous cleaning media. However, CFC/ODS products are not used in the production of these devices and are not recommended. Solvents containing methylene chloride or other epoxy solvents should be avoided since these attack the epoxy encapsulation material. 9 Recommended Mounting Pad Geometries: The area under the tantalum wire nib should not be metallized on the PC board. The width dimension indicated is the same as the maximum width of the capacitor. This is to minimize lateral movement. 250 200 150 100 50 TIME (SECONDS) 0 50 100 150 200 250 300 350 RECOMMENDED REFLOW SOLDERING PROFILE GUIDE TO APPLICATION (Continued) PAD CASE WIDTH METALIZATION SEPARATION CODE (A) (B) (C) A 0.65 0.050 0.040 (1.6) (1.3) (1.0) B 0.065 0.070 0.055 (1.6) (1.8) (1.4) C 0.065 0.070 0.120 (1.6) (1.8) (0.3) D 0.115 0.070 0.070 (2.9) (1.8) (1.8) E 0.115 0.070 0.120 (2.9) (1.8) (3.0) F 0.150 0.070 0.140 (3.8) (1.8) (3.6) G 0.125 0.070 0.170 (3.2) (1.8) (4.3) H 0.165 0.090 0.170 (4.2) (2.3) (4.3) B C B A |
Similar Part No. - CWR06CB155J |
|
Similar Description - CWR06CB155J |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |