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NCV2820MUTBG Datasheet(PDF) 3 Page - ON Semiconductor |
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NCV2820MUTBG Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 21 page NCP2820 Series http://onsemi.com 3 MAXIMUM RATINGS Symbol Rating Max Unit Vp Supply Voltage Active Mode Shutdown Mode 6.0 7.0 V Vin Input Voltage −0.3 to VCC +0.3 V Iout Max Output Current (Note 1) 1.5 A Pd Power Dissipation (Note 2) Internally Limited − TA Operating Ambient Temperature −40 to +85 °C TJ Max Junction Temperature 150 °C Tstg Storage Temperature Range −65 to +150 °C RqJA Thermal Resistance Junction−to−Air 9−Pin Flip−Chip UDFN8 90 (Note 3) 50 °C/W − − ESD Protection Human Body Model (HBM) (Note 4) Machine Model (MM) (Note 5) > 2000 > 200 V − Latchup Current @ TA = 85°C (Note 6) 9−Pin Flip−Chip UDFN8 $70 $100 mA MSL Moisture Sensitivity (Note 7) Level 1 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The device is protected by a current breaker structure. See “Current Breaker Circuit” in the Description Information section for more information. 2. The thermal shutdown is set to 160°C (typical) avoiding irreversible damage to the device due to power dissipation. 3. For the 9−Pin Flip−Chip CSP package, the RqJA is highly dependent of the PCB Heatsink area. For example, RqJA can equal 195°C/W with 50 mm2 total area and also 135°C/W with 500 mm2. When using ground and power planes, the value is around 90°C/W, as specified in table. 4. Human Body Model: 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114. On 9−Pin Flip−Chip, B2 Pin (VP) is qualified at 1500 V. 5. Machine Model: 200 pF discharged through all pins following specification JESD22/A115. 6. Latchup Testing per JEDEC Standard JESD78. 7. Moisture Sensitivity Level (MSL): 1 per IPC/JEDEC standard: J−STD−020A. |
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