B331

MDF51 Series

1. Recommended temperature profile

2. Recommended flow temperature

3. Recommended manual soldering

4. Recommended screen thickness

and open area ratio

(Pattern area ratio)

5. Board warpage

6. Cleaning conditions

7. Wire preparation and contact

crimping

Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions,

provided that there is a return to normal temperature between the first and

second cycle.

Note 2: The temperature profile indicates the board surface temperature at the point of

contacts with the connector terminals.

Peak temperature: 260ç for 10 seconds max.

Manual soldering: 380ç for 3 seconds

Thickness: 0.15 mm

Open area ratio: 100%

Maximum of 0.03 mm at the connector center, with both ends of the connector as reference points.

Refer to "Nylon Connector Use Handbook".

Refer to “Nylon Connector Use Handbook”.

The crimp contact termination must be performed using specified tools.

All dimensions and crimp conditions are listed in applicable Crimp Condition Table and

Crimping Quality Standards Manual.

10sMAX

30~60sec

60~120sec

255

180

ç

100

150

200

250

230

ç

Time (Seconds)

Temperature (ç)

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.

All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.