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SN74LVC2G08DCUR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVC2G08DCUR Datasheet(HTML) 1 Page - Texas Instruments |
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1 / 12 page  SN74LVC2G08 DUAL 2INPUT POSITIVEAND GATE SCES198J − APRIL 1999 − REVISED SEPTEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Available in the Texas Instruments NanoStar and NanoFree Packages D Supports 5-V VCC Operation D Inputs Accept Voltages to 5.5 V D Max tpd of 4.7 ns at 3.3 V D Low Power Consumption, 10-µA Max ICC D ±24-mA Output Drive at 3.3 V D Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C D Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C D Ioff Supports Partial-Power-Down Mode Operation D Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 1000-V Charged-Device Model (C101) description/ordering information This dual 2-input positive-AND gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G08 performs the Boolean function Y + A • Bor Y + A ) B in positive logic. ORDERING INFORMATION TA PACKAGE† ORDERABLE PART NUMBER TOP-SIDE MARKING‡ NanoStar − WCSP (DSBGA) 0.17-mm Small Bump − YEA SN74LVC2G08YEAR NanoFree − WCSP (DSBGA) 0.17-mm Small Bump − YZA (Pb-free) Reel of 3000 SN74LVC2G08YZAR _ _ _CE_ −40 °C to 85°C NanoStar − WCSP (DSBGA) 0.23-mm Large Bump − YEP Reel of 3000 SN74LVC2G08YEPR _ _ _CE_ −40 °C to 85°C NanoFree − WCSP (DSBGA) 0.23-mm Large Bump − YZP (Pb-free) SN74LVC2G08YZPR SSOP − DCT Reel of 3000 SN74LVC2G08DCTR C08_ _ _ VSSOP − DCU Reel of 3000 SN74LVC2G08DCUR C08_ VSSOP − DCU Reel of 250 SN74LVC2G08DCUT C08_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoStar and NanoFree are trademarks of Texas Instruments. DCT OR DCU PACKAGE (TOP VIEW) 1 2 3 4 8 7 6 5 1A 1B 2Y GND VCC 1Y 2B 2A 4 3 2 1 5 6 7 8 GND 2Y 1B 1A 2A 2B 1Y VCC YEA, YEP, YZA, OR YZP PACKAGE (BOTTOM VIEW) PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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