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RT9172N-22CT5 Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9172N-22CT5 Datasheet(HTML) 9 Page - Richtek Technology Corporation |
9 / 16 page Preliminary RT9172 DS9172-03 April 2002 www.richtek-ic.com.tw 9 Heatsinking TO-220Packages The thermal resistance of a TO-220 package can be reduced by attaching it to a heat sink or a copper plane on a PC board. If a copper plane is to be used, the values of θJA will be same as shown in next section for TO-263 package. Heatsinking TO-263 and SOT-223 Packages The TO-263 and SOT-223 packages use the copper plane on the PCB as a heatsink. The tab of these packages are soldered to the copper plane for heat sinking. Fig.4 shows a curve for θJA of TO-263 package for different copper area sizes, using a typical PCB with 1 ounce copper and no solder mask over the copper area for heat sinking. As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θJA for the TO- 263 package mounted to a PCB is 32 °C/W. θθθθJA vs. Copper (1 Ounce) Area for TO-263 Fig. 4 0 20 40 60 80 100 120 140 160 180 200 00.5 11.5 22.5 3 Copper Foil Area (SQ. IN.) 4W 2.5W 1W |
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