Dual DMOS Full-Bridge Motor Driver

A3916

9

Allegro MicroSystems, LLC

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

PACKAGE OUTLINE DRAWINGS

Figure 2: 16-contact 3 mm × 3 mm QFN package (Suffix ES)

For Reference Only – Not for Tooling Use

(Reference JEDEC MO-220WEED-4)

Dimensions in millimeters – NOT TO SCALE

Exact case and lead configuration at supplier discretion within limits shown

A

B

C

16

2

1

A

16

1

2

B

1.70

1.70

1.70

1.70

0.30

1

16

3

3

0.75

0.25

0.50

0.40

0.50

0.90

3.10

3.10

C

Reference land pattern layout (reference IPC7351 QFN50P300X300X80-17W2M); all pads a minimum

of 0.20 mm from all adjacent pads; adjust as necessary to meet application process requirements and

PCB layout tolerances; when mounting on a multilayer PCB, thermal vias at the exposed thermal pad

land can improve thermal dissipation (reference EIA/JEDEC Standard JESD51-5)

PCB Layout Reference View

Terminal #1 mark area

Exposed thermal pad (reference only, terminal #1 identifier appearance at supplier discretion)