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LM317SX Datasheet(PDF) 11 Page - National Semiconductor (TI) |
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LM317SX Datasheet(HTML) 11 Page - National Semiconductor (TI) |
11 / 25 page Application Hints (Continued) TABLE 1. θ JA Different Heatsink Area (Continued) Layout Copper Area Thermal Resistance 10 0 0.8 57 11 0 1 57 12 0.066 0.066 89 13 0.175 0.175 72 14 0.284 0.284 61 15 0.392 0.392 55 16 0.5 0.5 53 Note: * Tab of device attached to topside of copper. 00906361 FIGURE 9. θ JA vs 2oz Copper Area for TO-252 00906363 FIGURE 10. Maximum Allowable Power Dissipation vs. Ambient Temperature for TO-252 www.national.com 11 |
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