CC-000017-DS revision: 11

Datasheet for CCS803

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© Cambridge CMOS Sensors Ltd, Deanland House, Cowley Road, Cambridge, CB4 0DL, UK

Website: www.ccmoss.com

Telephone: +44 1223 395 551

Date Issued: 26 May 2016

The recommended package footprint or landing pattern for CCS803 is shown below:

Note:

1.

All dimensions are in mm

2.

3.

4.

Add 0.05mm all around the nominal lead

width and length for the PCB land pattern

DESCRIPTION

SYMBOL

MIN

NOM

MAX

TOTAL THICKNESS

A

0.95

1.0

1.05

STAND OFF

A1

0

0.035

0.05

LEAD WIDTH

b

0.7

0.75

0.8

BODY SIZE

D

3 BSC

E

2 BSC

LEAD PITCH

e

1.0 BSC

EP SIZE

J

1.06

1.16

1.26

K

1.3

1.4

1.5

LEAD LENGTH

L

0.25

0.3

0.35

L1

0.35

0.4

0.45

ALL DIMENSIONS ARE IN MM

Top View

4

3

2

1

1.5

0.45

0.85

1.30

0.45

0.85

Pin 1 Corner

DFN package outline