NCV7428

www.onsemi.com

4

Table 3. ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Min

Max

Units

−0.3

45

V

−0.3

6

V

Maximum voltage at LIN bus pin

−45

45

V

Maximum voltage at digital input pins (TxD, EN)

−0.3

45

V

Maximum voltage at digital output pins (RxD, RSTN)

−0.3

V

Ambient temperature range

−40

+125

°C

Junction temperature range

−40

+170

°C

Storage temperature range

−55

+150

°C

System ESD at pins VS, LIN as per IEC 61000−4−2: 330

W / 150 pF

(Verified by external test house)

≥ ±14

kV

Human body model at pins VS, LIN stressed towards GND with 1500

W / 100 pF

≥ ±8

kV

Human body model at all pins as per JESD22−A114 / AEC−Q100−002

≥ ±4

kV

Charge device model at all pins as per JESD22−C101 / AEC−Q100−011

≥ ±500

V

Machine model; (200 pF; 0.75

mH; 10 W) as per JESD22−A115 / AEC−Q100−003

±200

V

MSL

Moisture Sensitivity Level

SOIC

DFN

2

1

−

Lead temperature Soldering − Reflow (SMD styles only), Pb−Free (Note 1)

260

°C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be affected.

1. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

Table 4. OPERATING RANGES

Symbol

Parameter

Min

Max

Units

VS operating voltage for parametric operation (Note 2)

5.5

28

V

VS operating voltage for limited operation (Note 2)

4

28

V

4.9

5.1

V

3.234

3.366

V

70

mA

Operating voltage at LIN bus pin

0

V

Operating voltage at digital input pins (TxD, EN)

0

5.5

V

Operating voltage at digital output pins (RxD, RSTN)

0

V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

operational (LIN pin toggling) but parameters cannot be guaranteed. For higher battery voltage operation above 28 V, LIN pull−up resistor

must be selected large enough to avoid clamping of LIN pin by voltage drop over external pull−up resistor and LIN pin min current limitation.

Table 5. THERMAL CHARACTERISTICS

Rating

Symbol

Value

Unit

Thermal Characteristics, SOIC−8 (Note 3)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)

125

75

°C/W

°C/W

Thermal Characteristics, DFN−8 (Note 3)

Thermal Resistance Junction−to−Air, Free air, 1S0P PCB (Note 4)

Thermal Resistance Junction−to−Air, Free air, 2S2P PCB (Note 5)

133

55

°C/W

°C/W

3. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe

Operating parameters.

4. Values based on test board according to EIA/JEDEC Standard JESD51−3, signal layer with 10% trace coverage.

5. Values based on test board according to EIA/JEDEC Standard JESD51−7, signal layers with 10% trace coverage for the signal layer and

4 thermal vias connected between exposed pad and first inner Cu layer.