NCV8184

http://onsemi.com

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1.0 oz Cu

2.0 oz Cu

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PULSE TIME (sec)

Figure 26. SOIC−8 Thermal Duty Cycle Curves on 1.0 in Spreader Test Board, 1.0 oz Cu

(1.0 in pad PCB) Die Size = 2.08 x 1.55 x 0.40 5.0% Active Area

Duty Cycle, D =

t 1

t 2

PDM

Notes:

t 1

t 2

50% Duty Cycle

20%

Single Pulse

10%

5%

2%

1%

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PULSE TIME (sec)

Figure 27. SOIC−8 Single Pulse Heating Curve