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NCS20092DR2G Datasheet(PDF) 4 Page - ON Semiconductor

Part # NCS20092DR2G
Description  Operational Amplifier, Rail-to-Rail Input
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NCS20092DR2G Datasheet(HTML) 4 Page - ON Semiconductor

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NCS20091, NCV20091, NCS20092, NCV20092, NCS20094, NCV20094
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4
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol
Limit
Unit
Supply Voltage (VDD – VSS) (Note 2)
VS
7
V
Input Voltage
VI
VSS − 0.5 to VDD + 0.5
V
Differential Input Voltage
VID
±Vs
V
Maximum Input Current
II
±10
mA
Maximum Output Current
IO
±100
mA
Continuous Total Power Dissipation (Note 2)
PD
200
mW
Maximum Junction Temperature
TJ
150
°C
Storage Temperature Range
TSTG
−65 to 150
°C
Mounting Temperature (Infrared or Convection – 20 sec)
Tmount
260
°C
ESD Capability (Note 3)
Human Body Model
Machine Model
Charge Device Model
ESDHBM
ESDMM
ESDCDM
2000
100
2000
V
Latch−Up Current (Note 4)
ILU
100
mA
Moisture Sensitivity Level (Note 5)
MSL
Level 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS for Safe Operating Area.
2. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction
temperature of 150
°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability.
Shorting output to either VDD or VSS will adversely affect reliability.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JEDEC standard: JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (JEDEC standard: JESD22−A115)
4. Latch−up Current tested per JEDEC standard: JESD78
5. Moisture Sensitivity Level tested per IPC/JEDEC standard: J
-STD-020A
THERMAL INFORMATION
Parameter
Symbol
Channels
Package
Single Layer
Board (Note 6)
Multi−Layer
Board (Note 7)
Unit
Junction to Ambient
Thermal Resistance
qJA
Single
SC−70
°C/W
SOT23−5/TSOP−5
UDFN6
Dual
Micro8/MSOP8
236
167
SOIC−8
190
131
TSSOP−8
253
194
Quad
SOIC−14
SOP−14
TSSOP−14
6. Value based on 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area
7. Value based on 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
OPERATING RANGES
Parameter
Symbol
Min
Max
Unit
Operating Supply Voltage
VS
1.8
5.5
V
Differential Input Voltage
VID
VS
V
Input Common Mode Range
VICM
VSS – 0.2
VDD + 0.2
V
Ambient Temperature
TA
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.


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