NCS2220A

http://onsemi.com

9

PACKAGE DIMENSIONS

UDFN8, 1.6x1.6, 0.4P

CASE 517AC−01

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.25 AND

0.30 mm FROM TERMINAL.

4. COPLANARITY APPLIES TO THE EXPOSED

PAD AS WELL AS THE TERMINALS.

5. EXPOSED PADS CONNECTED TO DIE FLAG.

USED AS TEST CONTACTS.

A

B

E

D

D2

E2

BOTTOM VIEW

b

e

8X

0.10

B

0.05

A

C

C

K

8X

NOTE 3

2X

0.10 C

PIN ONE

REFERENCE

TOP VIEW

2X

0.10 C

8X

A

A1

(A3)

0.08 C

0.10 C

C

SEATING

PLANE

SIDE VIEW

L

8X

1

4

5

8

DIM MIN

NOM

MAX

MILLIMETERS

A

0.45

0.50

0.55

A1

0.00

0.03

0.05

A3

0.127 REF

b

0.15

0.20

0.25

D

1.60 BSC

D2

0.70

0.80

0.90

E

1.60 BSC

E2

0.40

0.50

0.60

e

0.40 BSC

K

0.20

−−−

−−−

L

0.20

0.30

0.40

(A3)

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

mm

inches

SCALE 20:1

0.902

0.0355

0.924

0.0364

0.490

0.0193

0.400

0.0157

PITCH

0.502

0.0197

0.200

0.0079

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