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MHBAWT-0000-000C0BE257E Datasheet(PDF) 2 Page - Cree, Inc |
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MHBAWT-0000-000C0BE257E Datasheet(HTML) 2 Page - Cree, Inc |
2 / 28 page Copyright © 2014-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp® and EasyWhite® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. 2 XLamp® mHB-a LED CHArACtEristiCs Characteristics unit Minimum typical Maximum Thermal resistance, junction to solder point °C/W 5.5 viewing angle (FWHM) degrees 115 Temperaturecoefficientofvoltage(9 V) mV/°C -4 Temperaturecoefficientofvoltage(18 V) mV/°C -8 Temperaturecoefficientofvoltage(36 V) mV/°C -16 eSD withstand voltage (HBM per Mil-Std-883D) v 8000 DCforwardcurrent(9 V) mA 480 700 DCforwardcurrent(18 V) mA 240 350 DCforwardcurrent(36 V) mA 120 175 Reversecurrent(9 V,18 V,36 V) mA 0.1 Forwardvoltage(9 V,@480 mA,85 °C) v 9.25 Forwardvoltage(9 V,@480 mA,25 °C) v 10.5 Forwardvoltage(18 V,@240 mA,85 °C) v 18.5 Forwardvoltage(18 V,@240 mA,25 °C) v 21 Forwardvoltage(36 V,@120 mA,85 °C) v 37 Forwardvoltage(36 V,@120 mA,25 °C) v 42 LeD junction temperature °C 150 |
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